Phasora3D has been included in the third batch of Jiangsu Province’s 2026 Science & Technology SMEs list (pending official inclusion), as published by the Jiangsu Provincial Department of Science and Technology — Entry No. 15100.
As a technology-driven company specializing in 3D imaging modules for inline full inspection in semiconductor packaging, we’re honored to have our innovation capability and R&D-to-market translation recognized at the provincial level.
Our Phasora3D series modules deliver high-precision 3D imaging for wafer micro-bumps, C4 bumps, and BGA ball grid arrays in advanced packaging — enabling precise control of packaging quality and yield.
We’ll keep advancing computational optics for semiconductor inspection — faster, more precise, and more stable. Onward!