UPCOMING EVENTS
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In Parts 1 and 2, we unpacked the production limits of DoF stacking and the underlying logic of Phasora3D's patented multi-layer focus tracking (displacement imaging). This post goes to engineering: how the PSR2000 series turns that architecture into a real-line solution for gold-wire-bonding pain points at OSATs.
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In our last post, we explained why full depth-of-focus (DoF) stacking — built on pixel fusion plus global smoothing — traps gold-wire-bonding 100% inspection in a triple bind: escaped defects, false calls, and throughput shortfalls. Resolving this contradiction means rethinking the imaging foundation itself.
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Advanced packaging has entered the era of high-density fine wires and chiplet stacking. At 0.6 mil, ultra-fine gold wire bonding is now standard — and so are the micrometer-scale defects that come with it: broken wires, wire sag and sweep, bond misalignment, and pad surface damage. Traditional 2D vision has hit its resolution ceiling, which is why 3D imaging has become essential for yield control at OSATs.
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The 2026 Bay Area Semiconductor Industry Ecosystem Expo (Bay Area Chip Expo) concluded on October 16 at the Shenzhen Convention and Exhibition Center (Futian). During the three-day event, Phasora3D Co., Ltd. hosted on-site 3D sample measurements at Booth 7E03, drawing customers who brought their own parts for live data capture.
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Phasora3D Co., Ltd. is proud to announce that we have passed the ISO 9001:2015 quality management system certification — equivalent to the Chinese national standard GB/T 19001-2016 — covering “R&D and production of semiconductor computational optics 3D imaging modules.” This milestone marks authoritative recognition of a quality management system spanning our entire R&D-to-production process.
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Phasora3D has been included in the third batch of Jiangsu Province’s 2026 Science & Technology SMEs list (pending official inclusion), as published by the Jiangsu Provincial Department of Science and Technology — Entry No. 15100.
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立足湾区产业高地，聚力半导体产业发展。为进一步深耕华南市场，加强行业资源互通，展示企业先进封装领域创新成果，我司即将亮相2026 湾区半导体产业生态博览会（湾芯展）。
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聚焦半导体先进封装前沿，赋能芯片产业提质增效！为深度链接行业前沿技术，对接上下游产业链资源，拓展产业合作渠道，我司正式确认参展 2026 IC 创新博览会。
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